CuspAI
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News from CuspAI
CuspAI
20 Jul 2026
CuspAI announces £335m Series B led by Kleiner Perkins and NEA to design new semiconductor, energy and advanced manufacturing materials
CuspAI builds an agentic AI platform, MIRA, that designs new materials to order, running the full cycle from generative design through simulation, synthesis planning and coordinated lab validation. The platform serves industrial and government R&D teams in semiconductors, clean energy and advanced manufacturing, where the materials needed for next-generation products do not yet exist.
CuspAI
10 Sept 2025
CuspAI raises £75m Series A led by NEA and Temasek to accelerate AI-driven materials discovery
CuspAI applies generative AI and physics based simulation to design new materials, helping customers discover compounds faster for applications in energy, climate, computing and manufacturing.
CuspAI
- Deep Tech
- Cambridge, United Kingdom
- £410m
- cusp.ai
- Update Information
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