CuspAI announces £335m Series B led by Kleiner Perkins and NEA to design new semiconductor, energy and advanced manufacturing materials

CuspAI builds an agentic AI platform, MIRA, that designs new materials to order, running the full cycle from generative design through simulation, synthesis planning and coordinated lab validation. The platform serves industrial and government R&D teams in semiconductors, clean energy and advanced manufacturing, where the materials needed for next-generation products do not yet exist.