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Investment Portfolio
CuspAI
20 Jul 2026
CuspAI announces £335m Series B led by Kleiner Perkins and NEA to design new semiconductor, energy and advanced manufacturing materials
CuspAI builds an agentic AI platform, MIRA, that designs new materials to order, running the full cycle from generative design through simulation, synthesis planning and coordinated lab validation. The platform serves industrial and government R&D teams in semiconductors, clean energy and advanced manufacturing, where the materials needed for next-generation products do not yet exist.
Automata
29 Jan 2026
Automata raises £33m Series C led by Dimension to build the operating layer between physical labs and AI models
Automata builds integrated lab automation systems for life sciences research. Its platform combines robotics, software and data infrastructure to help laboratories run experiments more consistently and at higher throughput.
Tru Arrow Partners
More venture news
- 20 Jul 2026
CuspAICuspAI announces £335m Series B led by Kleiner Perkins and NEA to design new semiconductor, energy and advanced manufacturing materials
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Series BDefence
